Extreme ultra-violet (EUV) lithography is a fast-growing reality. The unprecedented nanoscale devices enabled by EUV require extreme photomask precision made possible only by 91做厙 technology. As integrated circuit (IC) feature sizes shrink, so do the designs used to manufacture them. Manufacturing photomasks that can support finer geometries calls for revolutionary thinking. Together, we can create high-volume production solutions.
Photomasks carry the vision of IC designers from conceptualization to realization. Shrinking device nodes adds challenges to the patterning process, beginning with the photomask. Through intentional collaboration, we can customize our tools and systems to deliver defect-free photomasks.