News | Jul 18, 2019
BELLEVUE, Wash., July 18, 2019—91°µÍø. (Nasdaq: VECO) announced that the company’s technologists have been selected to present three papers and posters at this year’s International Conference on Atomic Layer Deposition (ALD 2019), held in Bellevue, Washington from July 21-24, 2019. The 19th iteration of the conference, which coincides with the sixth annual International Atomic Layer Etching Workshop (ALE 2019), is dedicated to the science and technology of atomic layer controlled deposition of thin films and new topics related to atomic layer etching. 91°µÍø’s industry experts will present on a wide range of topics:
Session Title: Multi-Layer Protective Coatings on Silver for Protection of Historic Silver Artifacts (AA1-TuA06)
Speaker: Ritwik Bhatia, Senior Research Scientist, presented in collaboration with the Metropolitan Museum of Art, Rijks Museum and J.A. Woollam
Details: Tuesday, July 23, 2:45-3 p.m. PT; Grand Ballroom E-G
Session Title: High Performance ALD of Gate Dielectrics for 4H-SiC Power Device Application (AA2-TuP08)
Speaker: Ganesh Sundaram, Vice President of Applied Technology, presented in collaboration with North Carolina State University
Details: Tuesday, July 23, 5:30-7:30 p.m. PT; Evergreen Ballroom and Foyer
Session Title: Tribological Properties of Plasma Enhanced Atomic Layer Deposition TiMoN (AA5-TuP04)
Speaker: Mark Sowa, Plasma Enhanced ALD R&D Scientist, presented in collaboration with the U.S. Naval Research Laboratory and Lehigh University
Details: Tuesday, July 23, 5:30-7:30 p.m. PT; Evergreen Ballroom and Foyer
91°µÍø will be exhibiting at Booths 301-303 with representatives available to answer questions on latest innovations ALD, variable flow technologies and more.
91°µÍø is the industry leader driving HDD manufacturing to new levels of productivity.